Transcript Document
VFE/MGPA considerations for EE/VPT EB/EE electrical spec. differences: full-scale signal noise input capacitance dominated by: APD capacitance (x2) for barrel VPT -> MGPA interconnect for end-cap MGPA suits barrel and endcap full-scale signal requirements because input stage gain defined by external feedback components Detailed lab measurements so far concentrated on EB application, but linearity and pulse shape matching performance dominated by gain and diff. O/P stages => should be same for EE Some EE specific measurements exist for noise and pulse shape, but not extensively studied so far Mark Raymond (Nov.2004) MGPA Target Specifications Parameter Barrel (APD) End-Cap (VPT) fullscale signal 60 pC 16 pC noise level (ENC) 10000e (1.6 fC) 3500e (0.56 fC) input capacitance ~ 200 pF (APD) ~ 50 pF (cable) output signals (to match ADC) gain ranges differential 1.8 V, 0.45 V around Vcm = Vdd/2 = 1.25 V 1, 6, 12 10 % pulse shaping 40 ns CR-RC nonlinearity (each range) < 0.1 % fullscale pulse shape matching (Vpk-25)/Vpk < 1 % within and across gain ranges 1 MGPA Architecture input stage CF chosen for max. poss. gain depending on barrel/end-cap RF chosen for 40 ns decay avoids pile-up CFRF external components => 1 chip suits barrel & end-cap CF//RF = 39pF//1k (barrel) = 8p2//4k7 (endcap) differential current O/P stages external termination 2RICI = 40 nsec. => low pass filtering on all noise sources within chip 3 gain channels 1:6:12 set by resistors (on-chip), for linearity, feeding commongate stages i I2C and offset generator RG1 CI RI i i RI VCM DAC CI RI ext. trig. CCAL input stage charge amp. I/P RF CF RG2 RI CI RI RG3 gain stages RFCF RI VCM VCM diff. O/P stages VCM 2 Transistor Level Schematic 3 Noise Sources input stage vRf Rf Cf common-gate gain stage source iCG follower RG vFET CIN iRG ENC input stage high Cf (low gain) to cope with large full-scale signals => corresponding low Rf for 40 ns time const. => Rf noise dominates over input FET hand calculation barrel ENC (CIN=200pF) diff. output stage end-cap ENC (CIN = 50 pF) Rf noise 4900 e 2700 e I/P FET 1800 e 660 e total 5220 e 2780 e 2.718 1.6 1019 2 2 2 kTC 2f RG C 2f RG2 icg CTOT kT v FET 2R f 8 4 gain stage contribution can’t avoid for low gain range (RG big) but this range only used for larger signals so signal/noise still acceptable these values calculated for CF//RF = 39pF//1k (barrel) CF//RF = 12pF//3k3 (endcap) (vFET ~ 0.23 nV/(Hz)1/2 ) 4 Choice of 1st stage feedback components CF RF fullscale signal [pC] RF noise [e] 6p8 5k6 38.1 10.5 2048 8p2 4k7 38.5 12.6 2236 10p 3k9 39.0 15.4 2475 12p 3k3 39.6 18.5 2700 39p 1k 39.0 60 4900 values normalised to 60 pC barrel fullscale ENC depends on fullscale signal requirement (VPT response and dynamic range requirement) barrel case 2.718 1.6 1019 2 2 2 kTC 2f RG C 2f RG2 icg CTOT kT v FET 2R f 8 4 5 Noise Measurement (VFE card) ENC [rms electrons] BARREL (CF//RF = 39pF//1k) END-CAP (CF//RF = 8p2//4k7) high gain chan. mid gain chan. high gain chan. mid gain chan. 4000 10000 8000 6000 4000 2000 0 3000 7240+5.8/pF 7870+4.9/pF 2000 3040+4.5/pF 3270+4.5/pF 1000 0 0 100 200 0 100 200 added capacitance [pF] 0 20 40 60 0 20 40 60 added capacitance [pF] weak dependence on input capacitance as expected within spec. for high and mid-gain ranges: barrel < 10000 e, end-cap < 3500 e low gain range: barrel: 27300 e ± 12% end-cap: 8200 e ± 11% completely dominated by gain stage noise but signals large => electronic noise not significant (< 0.2% contribution to overall barrel energy res’n.) 6 End-cap signal simulation CSA O/P End-cap VPT interface coax without coax I(t) Cdet with coax MGPA I(t) current source with 10 ns decay time Cdet = 5 pF (2 pF + stray) chip O/P coax = RG 179 (thin 50 ohm) 75 cm long some ringing observable at input stage O/P without coax smoothed out at chip O/P with coax previously presented at design review (Jan.2003) 7 Measurement 0.4 fast (5 ns) charge injection 10 ns exponential charge injection 2 pF 0.2 80 cm. thin 50 W coax pulse shapes at chip O/P Volts 0.0 -0.2 MGPA high gain range ~ ¾ fullscale signal -0.4 -0.6 -0.8 200 250 300 350 nsec. 400 450 500 8 Specific EE issues input protection on-chip protection not sufficent to withstand VPT breakdown (RAL measurements already proved) => additional external protection diode => extra capacitance (~ few 10’s pF shouldn’t be a problem) => prot. diode rad-hardness issues coax MGPA more remote opto-electric transducer => transmission line effects => grounding/shielding issues HV filter card diagram - courtesy Claire Shepherd-Themistocleous 9